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1. UVTM Sputtering Targets

UVTM targets include metal target,ceramic target and alloy target.By Spraying, casting, melting, bonding & sintering according to different materials and shape.Providing lots of sputtering targets with high purity and density: Ag, SiAl, NbOx, ...

2. 99.99%Planar Cu Target

Product Description

Material type: Copper
Chemical Composition: Cu
Density: >8.9g/cm3(100%)
Purity: 99.99%
Grain size: <50um
Molding Process: Melting-Rolling
Max Machining Size: L1900*W280*T18mm
Maximum Impurities content ...

3. UVTM Rotatable SiAl Alloy Target

Material type: Silicone Aluminum
Symbol: SiAl
Proportion: 90:10wt%±1%
Purity: >99.9%
Color/Appearance: Silvery,Metallic
Dentity: >2.2g/m3(>94%)
Molding Process: HPS

Maximum Impurities content Unit: ppm

Fe ≤500 ...

4. 99.999% Bonding Planar Si Target

Product Description
Material type: Silicon
Composition: Si
Density: >2.33 g/cm3
Purity: >99.999%
Color: Grey
Resistivity: (20 degree), <0.002 OHM.cm
Molding Process: Straight, pull/casting
L300*W300*15mm, muti-assemblies bonded ...

5. 99.99% UVTM Rotatable Argentum Target

Product Description
Material type: Argentum
Chemical Composition: Ag
Density: >10.5 g/cm3
Purity: >99.99%
Grain size: <50um
Molding Process: Assembly on the backing tube
Max Machining Size: L4000mm
Shape: Straight,dog bone

Maxim ...