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1. PCB

Technical requirements:
Material: FR-4
Layer: 2 layer
Thickness of cooper: 2/2 Oz
Thickness of board: 1.6MM
Surface finish: HASL LF + Gold finger
Min. hole size: 0.2mm
Min.line width: 0.1mm
Min.line space: 0.15mm

Contact way:
Skype: ...

2. PCB

Technical description:
layer: 18
material: FR4 Tg170
Board thickness: 5.0mm
Surface finish: Immersion Tin
Min through hole: 0.3mm
Min line width: 0.15mm
Min line space: 0.2mm
RoHS

Contact way:
Skype: eg_bruce
Mail: leon.zhang(a)sayfu ...

3. pcb

Layer: 10
Material: FR-4,
Board thickness2.0mm
Surface finish: Immersion Tin
Cooper thickness: Inner layer 3 Oz, out layer, 4Oz
Min through hole: 0.2mm
Min line width: 0.25mm
Min line space: 0.25mm
Special requirements: controlled impedance ...

4. PCB

Technical description:
Material: FR-4
Layer: 6
Thickness of board: 1.6MM
Surface finish:Flash gold
Min. hole size: 0.1mm(4mil)
Min.line width: 0.075mm3mil)
Min.line space: 0.1mm(4mil)
Special technique: Blind & buried Vias+Impedance ...

5. PCB

Technical description:
layer: 10
material: FR4
Board thickness: 2.36mm
Cooper thickness: 1/1 Oz
Surface finished: immersion gold
Min through hole: 0.2mm(8mil)
Min line width: 0.075mm3mil)
Min line space: 0.1mm(4mil)
Special requirements: ...